BGA and CSP ball existence/chip inspections
Lead frame deformation/chip inspections
The addition of various general purpose inspection tools (package detection / inspections, blob inspections, DefFinder®: general purpose visual inspections, etc.) makes various types of composite inspections possible.
ptimal straight lines from the edges of package boundaries are calculated, and points of intersection between them are used
to detect package positions. The detected package information makes various inspections possible.
Even for inspection targets like silicon chips that tend to vary in size, a mask for each chip is created along each rectangular edge.
Mask output will be precisely done for each target.
Chamfer the corner
Round off the corner
Round off the corner (inward)The lighting conditions can be switched to the ones that are optimal for the inspection items to achieve consistent inspections.
Package-chip inspection
Ball-internal foreign matter inspection
We are an expert group in the field of visual inspections and image processing inspections. We are not just a manufacturer. Instead, we are a visual inspection and image processing inspection system manufacturer that combines knowledge of and experience related to image processing algorithms, optical technology, electronics, and machinery in order to provide comprehensive consulting as a development engineering company.
